Transfer Molding Press

FUSEI MENIX manufactures and supplies the world's best equipment with cutting-edge technology.

Transfer Molding Press

Through Multi Ram System, FUSEI MENIX PCB Vacuum Hot Press achieves uniform pressure distribution and vacuum control with excellency.

Molding M/C for MASS Products

It is a popular molding machine used for the packaging process during semiconductor post-processing. It is used by more than 100 companies in 15 countries in Korea and abroad. The packaging process is the process of manufacturing the final semiconductor chip by molding an epoxy molding compound to protect the chip. In addition to semiconductor processing, it has recently been used in various fields, such as LED lenses, PCB molding, and electric vehicle motor cores.

Molding M/C for One Cavity

Small-size molding M/C has been required as the demand for molding M/C for sample production has expanded in small production plants or research institutes. It has the same performance as the 250-ton facility for mass production and is manufactured in a small size for One Cavity.

Molding M/C for Book Mold Sample

With the emergence of various EMC makers, the need for physical properties testing for compounds has increased. This facility is a small book mold facility. Compound manufacturers and users use this facility to conduct various physical property tests such as a spiral flow Test or EMC adhesion test.

Vacuum Type Molding M/C

Recently, as the size of semiconductor chips, such as power devices, has increased, the void has emerged as an important management point, and the demand for vacuum-type molding machines has increased significantly.